Santec TMS-2000 Wafer Thickness Mapping System (1 nm)

 1. High Accuracy

 High accuracy measurement using interferometric detection technique (1 nm repeatability)

 2. Industry Standard Parameters

 Analysis of Global (GFLR, GFLD, GBIR), Site (SFQR, SFQD, SBIR), Edge (ESFQR) possible

 3. High Environmental Resistance

 No temperature control or vibration countermeasures are required due to  environmental durability

 Small form factor suitable for multiple applications

 4. Compact Size

 Analysis Software

 Thickness Measurement Site Analysis Edge Analysis

 5. High Speed

 Spiral Scanning (High speed, high density)

Note: Customers are advised to carefully read the Datasheet to select the correct ordering code that meets their usage requirements.